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FUJIMI INCORPORATED

5384Prime MarketGlass & Ceramics Products

株式会社フジミインコーポレーテッド logo
FUJIMI INCORPORATED5384

Japan

Core domestic manufacturing and sales segment, the largest base accounting for approximately 57% of group sales

PeriodCurrentPreviousChange
Sales (external customers)¥39,450 million¥35,464 million
Segment profit (operating income)¥11,401 million¥9,722 million
Segment assets¥69,934 million¥49,438 million
Capital expenditures (increase in tangible and intangible fixed assets)¥22,746 million¥12,422 million
Depreciation and amortization¥1,433 million¥1,299 million
Intersegment internal sales¥11,520 million¥10,485 million

Business Details

The Japan segment consists of the Company (Fujimi Incorporated) and Nanko Ceramics Co., Ltd. It manufactures and sells Abrasives for Silicon Wafers (Lapping Materials and Polishing Materials), CMP Products, Abrasives for Hard Disk Substrates, General Industrial Abrasives, and other products. It also plays a major role as a manufacturing hub responsible for internal transfers to North America and Asia, with intersegment sales amounting to ¥11,520 million in FY2026 (ending March 2026).

Recent Overview

Driven by CMP Products and polishing materials, sales grew 11.2% and operating income grew 17.3%

In FY2026 (ending March 2026), the Japan segment achieved sales of ¥39,450 million (up 11.2% year on year) and segment profit of ¥11,401 million (up 17.3% year on year), driven by increased sales of CMP Products for advanced semiconductors and Abrasives for Silicon Wafers (Polishing Materials). Meanwhile, segment assets increased by ¥20,496 million year on year due to large-scale capital investment (increase in tangible and intangible fixed assets of ¥22,746 million). A total impairment loss of ¥369 million was recorded at the advanced technology/functional materials operations and the Biwajima Plant.

Key Products

product
CMP Products

Slurries, pads, and other materials used in chemical mechanical polishing (CMP) processes in semiconductor manufacturing. Sales for advanced logic and advanced memory applications increased against the backdrop of AI-related demand, with group-wide CMP Products sales reaching ¥36,135 million (up 17.9% year on year). The Japan segment serves as the primary manufacturing base.

product
Abrasives for Silicon Wafers (Polishing Materials)

Polishing slurry used in the mirror-finishing process of silicon wafers. Group-wide sales reached ¥13,384 million (up 5.4% year on year). One of the key products whose increased sales in the Japan segment drove overall performance.

product
Abrasives for Silicon Wafers (Lapping Materials)

Lapping materials used in the shaping and rough polishing process of silicon wafers. Group-wide sales were roughly flat at ¥7,590 million (up 0.4% year on year). While sales for small-diameter applications declined in the North America segment, the Japan segment maintained a certain level of sales.

product
General Industrial Abrasives (Polishing Solutions)

Abrasives used in general industrial applications such as metals, ceramics, and optical components. Group-wide sales of General Industrial Abrasives reached ¥6,426 million (up 18.7% year on year), driven in part by the addition of sales from Nanko Ceramics, which became a subsidiary in the prior fiscal year.

product
Thermal Spray Materials & Advanced Functional Materials

Powder materials used in various thermal spray processes, as well as advanced technology and functional materials. During the fiscal year, an impairment loss of ¥305 million was recorded on certain fixed assets belonging to the advanced technology/functional materials category (development equipment in Kakamigahara City, Gifu Prefecture) due to unforeseen changes in market conditions.

Growth Drivers

  • Expanding demand for CMP Products for advanced semiconductors (increased sales for advanced logic and advanced memory applications, with group CMP Products sales up 17.9% year on year)
  • Strong sales of polishing materials for silicon wafers (up 5.4% year on year group-wide)
  • Expanded sales of General Industrial Abrasives following the consolidation of Nanko Ceramics as a subsidiary (up 18.7% year on year group-wide)
  • Continued growth of the semiconductor market driven by AI-related demand, expanding customer capital expenditure
  • Enhanced production capacity and supply capability through large-scale capital investment (increase in tangible fixed assets of ¥22,746 million)

Risks

  • Risk of slowing sales due to delayed recovery in semiconductor demand for PCs, smartphones, and automotive applications
  • Continued uncertainty in the global economy due to China's economic slowdown and US tariff measures
  • Increased fixed costs and depreciation, and utilization rate risk, associated with large-scale capital investment (net increase of ¥19,845 million in buildings and structures year on year)
  • Risk of market condition changes in the advanced technology/functional materials field (an impairment loss of ¥305 million was recorded during the fiscal year)
  • High dependence on semiconductor market conditions, with the risk that the sales composition ratio of non-semiconductor fields falls short of plan
  • Supply chain risk from difficulty in procuring raw materials and rising raw material prices

Last updated: June 19, 2026