C. Uyemura & Co. , Ltd.
4966・Standard Market・Chemicals
Surface Treatment Materials Business
Uyemura's core segment, deploying plating chemicals globally and accounting for approximately 85% of consolidated sales.
| Period | Current | Previous | Change |
|---|---|---|---|
| Net Sales (Full Year, FY2026 (ending March 2026)) | ¥77,661 million | ¥69,581 million | ↑ |
| Segment Profit (Full Year, FY2026 (ending March 2026)) | ¥20,428 million | ¥17,805 million | ↑ |
| Segment Assets (Full Year, FY2026 (ending March 2026)) | ¥71,030 million | ¥66,422 million | ↑ |
| Depreciation (Full Year, FY2026 (ending March 2026)) | ¥1,877 million | ¥1,663 million | ↑ |
| Capital Expenditures (Increase in Tangible and Intangible Fixed Assets, Full Year, FY2026 (ending March 2026)) | ¥2,729 million | ¥2,284 million | ↑ |
| Impairment Loss (Full Year, FY2026 (ending March 2026)) | ¥1,476 million | ¥0 million | ↓ |
Business Details
The core business manufacturing and selling plating chemicals for printed circuit boards and aluminum magnetic disks, industrial chemicals, and non-ferrous metals. The company and 10 consolidated subsidiaries in Japan and overseas (Taiwan, China, South Korea, Singapore, North America, etc.) operate this business. Major customers include semiconductor package substrate manufacturers and automotive electronic component manufacturers. Against a backdrop of generative AI server demand and progress in automotive electrification and autonomous driving technology, the segment is focusing on the development and expanded sales of high-value-added plating chemicals.
Recent Overview
Driven by generative AI server demand, both sales and profit increased substantially year on year.
In FY2026 (ending March 2026), the Surface Treatment Materials Business recorded net sales of ¥77,661 million (up 11.6% year on year) and segment profit of ¥20,428 million (up 14.7% year on year). The main driver was strong performance in plating chemicals for semiconductor package substrates, centered on generative AI server demand. By region, Taiwan (¥20,485 million), Japan (¥24,869 million), and China (¥17,918 million) were the major markets. In addition, an impairment loss of ¥1,476 million related to idle land in Settsu City, Osaka Prefecture (following cancellation of a planned new product warehouse) was recorded in this segment.
Key Products
Growth Drivers
- Increased demand for plating chemicals for semiconductor package substrates due to expanding generative AI-related server demand
- Solid trend in demand for automotive power devices and ADAS-related applications amid progress in automotive electrification and autonomous driving technology
- Response to needs for miniaturization and higher performance of package substrates driven by the introduction of next-generation communication standards
- Continued focus on development and expanded sales of high-value-added products
- Continued expansion of demand for advanced package substrates in AI-related fields (next-period outlook)
Risks
- Global economic slowdown and impact on the electronics market due to U.S. trade policy (tariff increases)
- Impact on supply to consumer fields such as PCs and smartphones due to tight memory supply-demand conditions
- Uncertainty in inventory adjustment and pace of demand recovery in the semiconductor and electronic components markets
- Foreign exchange fluctuations (risk of reduced overseas earnings from yen appreciation)
- Risk of fluctuation in automotive-related demand due to a slowdown in growth of the electric vehicle (EV) market
- Impact on profitability from intensifying price competition with competitors
Last updated: June 24, 2026