C. Uyemura & Co. , Ltd.
4966・Standard Market・Chemicals
Business
Uyemura & Co., Ltd., founded in 1933, is a manufacturer of plating chemicals and machinery. Its core business is the Surface Treatment Materials Business (approximately 85% of consolidated sales), centered on plating chemicals for printed circuit boards and semiconductor package substrates, alongside the Surface Treatment Machinery Business, Plating Processing Business, and Real Estate Leasing Business. In addition to its domestic operations, the company has 10 subsidiaries in the United States, Singapore, Taiwan, Malaysia, Hong Kong, China, South Korea, Thailand, and Indonesia, building a global manufacturing, sales, and development framework. Its main customers are in the electronics and automotive industries, and it provides high-value-added products for semiconductor package substrates used in generative AI-related servers and for automotive power devices.
Business Model
In its core Surface Treatment Materials Business, the company achieves stable earnings through a consumables-type business model in which in-house developed plating chemicals are produced to forecast and continuously sold through global bases. This is combined with the Surface Treatment Machinery Business (build-to-order) and plating control equipment, and the total solution strategy of providing chemicals, machinery, and control equipment as an integrated package raises customers' switching costs and maintains competitive advantage. The group's Plating Processing Business also functions as a venue for accumulating technical know-how.
Company Strengths
The company handles not only the development of plating chemicals but also the development of plating machinery equipment and bath control equipment consistently within the group, while also building a system to accumulate know-how through its Plating Processing Business. R&D expenses for FY2026 (ending March 2026) totaled ¥2,685 million, and the company holds/has applied for 637 patents in Japan and overseas (159 domestic, 478 overseas). Comprehensive technological capabilities that are difficult for competitors to replicate in a short period serve as the source of competitive advantage.
Starting with the establishment of a US subsidiary in 1985, the company successively expanded into Taiwan, Hong Kong, Singapore, Malaysia, China, South Korea, Thailand, and Indonesia, and now has 10 consolidated subsidiaries. It has also established overseas R&D bases in Taiwan, Malaysia, China, and Thailand, achieving region-focused product development and sales. A system located close to the manufacturing sites of package substrate manufacturers, its key customers, enhances its customer responsiveness.
For FY2026 (ending March 2026), the company achieved operating income of ¥21,327 million (operating margin of 23.2%) against net sales of ¥91,784 million. With net assets of ¥116,665 million against total assets of ¥139,570 million (equity ratio exceeding 83.5%), financial soundness is high, and the company holds cash and cash equivalents of ¥51,816 million. It has set management targets of ROE of 10% or more and dividends per share of ¥200 or more, and continues to return profits to shareholders.
ENVALITH's Perspective
Performance Trend
Revenue increased 27% over five fiscal years, from ¥72,304 million in FY2022 (ending March 2022) to ¥91,784 million in FY2026 (ending March 2026). Operating profit rose 53% over the same period, from ¥13,947 million to ¥21,327 million, with the operating margin improving from 19.3% to 23.2%. As an external factor, demand for generative AI-related servers strongly drove demand for plating chemicals used in semiconductor package substrates. Net profit in FY2026 (ending March 2026) was ¥13,946 million, down 0.9% year on year, due to the recording of an impairment loss of ¥1,476 million (on idle land in Settsu City, Osaka Prefecture); however, this was a one-time factor, and on an ordinary profit basis, profit increased 10.2%, indicating that underlying earnings power actually improved. FY2027 (ending March 2027) is expected to see revenue growth but declines in operating profit and ordinary profit, suggesting a slowdown in the pace of growth.
Growth Strategy
Development and expansion of high-value-added products for AI, automotive, and next-generation communications, together with deepening of global operations across Asia and North America
Against a backdrop of expanding demand for semiconductor packaging substrates for generative AI servers, the company continues to strengthen the development, proposal, and sales expansion of high-value-added plating chemicals. In FY2026 (ending March 2026), sales in the Surface Treatment Materials Business reached ¥77,661 million (up 11.6% year on year), with segment profit of ¥20,428 million (up 14.7% year on year), confirming the effectiveness of this strategy.
In the Surface Treatment Machinery Business, the company is focusing on sales of high-value-added products such as Plating Equipment for Semiconductor Wafers. In FY2026 (ending March 2026), segment sales decreased 8.2% year on year, but segment profit improved significantly to ¥862 million (up 48.0% year on year), raising the profit margin to 10.3%. The company continues to promote the development of a machinery business equipped with new functions capable of responding to cost competition.
To capture expanding demand related to automotive power devices and ADAS driven by progress in vehicle electrification and autonomous driving technology, the company is strengthening its development and sales structure for plating chemicals for the semiconductor and automotive electronics fields as well as plating chemicals compliant with environmental regulations. Continued investment is being made in this field, which is expected to see medium- to long-term demand growth.
Through a recovery in demand for plating processing for electronic circuit boards and efforts to reduce costs and improve yield, the company achieved segment profit of ¥168 million in FY2026 (ending March 2026) (versus a segment loss of ¥47 million in the previous fiscal year), realizing a turnaround to profitability. The company will continue to promote improvements in production efficiency and capture demand.
R&D expenses in FY2026 (ending March 2026) increased to ¥2,702 million (up 5.9% from ¥2,552 million in the previous fiscal year), maintaining an upward trend. The company continues to invest at a level equivalent to 2.9% of sales, promoting the development of next-generation plating technologies and products compliant with environmental regulations, thereby expanding its patent portfolio and maintaining technological barriers to entry.
Last updated: July 19, 2026

