TOKYO SEIMITSU CO.,LTD.
7729・Prime Market・Precision Instruments
Semiconductor Production Equipment
Core segment manufacturing and selling processing and inspection equipment for the semiconductor manufacturing process
| Period | Current | Previous | Change |
|---|---|---|---|
| Segment assets (end of FY2026 (ending March 2026)) | ¥190,102 million | (Prior-period comparison figure not disclosed in this restatement) | ↑ |
Business Details
Manufactures and sells processing and inspection equipment for semiconductor manufacturing processes, including Wafer Probing Machines, Wafer Dicing Machines, and CMP Equipment. This is the company's core business, accounting for approximately 75% of total sales. Production is centered domestically (head office and Nagoya Plant), with subsidiaries Toseiengineering Co., Ltd. and ACCRETECH ADAMAS (THAILAND) handling a portion of production. Sales are conducted globally through local subsidiaries in the Americas, Europe, and Asia. Major customers include semiconductor manufacturers and OSAT (outsourced semiconductor assembly and test) companies.
Recent Overview
Following the restatement disclosure, segment assets were revised and finalized at ¥190,102 million
Regarding the earnings report for FY2026 (ending March 2026) disclosed on May 13, 2026, an error was found in the recognition of retirement benefit-related assets and liabilities, and a correction was made on May 18, 2026. Following the correction, Semiconductor Production Equipment segment assets were revised to ¥190,102 million (¥189,851 million before correction), and Measuring Instruments segment assets were revised to ¥57,777 million (¥57,413 million before correction). On a consolidated basis, total assets were finalized at ¥250,533 million, net assets at ¥192,916 million, and comprehensive income at ¥26,749 million (+0.9% year-on-year). Net income of ¥24,831 million on the income statement, as well as sales and operating income figures, remained unchanged; the main cause was a revision of the retirement benefit adjustment amount (other comprehensive income) from ¥-270 million to ¥+440 million.
Key Products
Growth Drivers
- Increased inquiries for HBM inspection equipment and AI packaging process equipment driven by growing demand for generative AI and HPC
- Steady demand from China as it advances domestic production of various semiconductor devices and electronic components
- Progress in shipments of already-booked orders in line with customer-requested delivery dates (in FY2025 (ended March 2025), both sales and orders reached new record highs)
- Expansion of production capacity through construction of the Nagoya Plant (addressing long-term growth in demand for processing equipment)
- Expected expansion of business opportunities driven by increased demand for semiconductors and electronic components stemming from adoption of edge AI in consumer applications
Risks
- Risk of demand fluctuation due to boom-bust cycles in the semiconductor industry (business performance has been significantly affected by this in the past)
- Uncertainty in the international situation due to trade friction and geopolitical tensions, including US tariff policy
- Continued soft demand for OSAT equipment for consumer electronics and slowing demand for power semiconductor equipment for EVs
- Profit pressure from rising material costs and labor costs (due to inflation and rising energy costs)
- Need for continuous investment in product development amid accelerating technological innovation, and intensifying competition
Last updated: June 19, 2026