MICRONICS JAPAN CO.,LTD.
6871・Prime Market・Electric Appliances
Probe Card Business
Core business accounting for 98.5% of consolidated net sales, driven by demand for HBM
| Period | Current | Previous | Change |
|---|---|---|---|
| Net sales (cumulative Q1, FY2026 ending March 2026) | ¥20,629 million | ¥13,663 million (cumulative Q1, FY2025 ending March 2025) | ↑ |
| Segment profit (cumulative Q1, FY2026 ending March 2026) | ¥6,817 million | ¥3,676 million (cumulative Q1, FY2025 ending March 2025) | ↑ |
| Segment profit margin (cumulative Q1, FY2026 ending March 2026) | 33.1% | 26.9% (cumulative Q1, FY2025 ending March 2025) | ↑ |
| Net sales (full-year results, FY2025 ending March 2025) | ¥68,525 million | - | — |
| Segment profit (full-year results, FY2025 ending March 2025) | ¥20,844 million | - | — |
| Segment profit margin (full-year results, FY2025 ending March 2025) | 30.4% | - | — |
Business Details
In the wafer inspection process of semiconductor manufacturing, this segment develops, manufactures, and sells probe cards that connect testers to semiconductor chip electrodes on silicon wafers by contacting pins. It holds a competitive advantage in the memory segment, with Samsung Electronics and Micron Memory Taiwan as its principal customers. In addition to domestic manufacturing, the segment conducts global sales and maintenance through subsidiaries in China, South Korea, Taiwan, Singapore, and Europe. In the first quarter of FY2026 (ending March 2026, i.e. the three months ended March 2026), Probe Cards for Memory performed strongly amid continued demand in the HBM market, and the segment achieved a 51.0% year-on-year increase in net sales and an 85.4% increase in profit, supported by expanded production capacity.
Recent Overview
Probe Cards for Memory performed strongly on continued HBM demand, with net sales up 51% and profit up 85% year-on-year
In the first quarter of FY2026 (ending March 2026) (January to March 2026), Probe Cards for Memory performed strongly against a backdrop of continued demand in the HBM market. Supported by expanded production capacity, net sales reached ¥20,629 million (up 51.0% year-on-year), and segment profit reached ¥6,817 million (up 85.4% year-on-year), with the segment profit margin improving substantially to 33.1% from 26.9% in the same period of the prior year. The segment's share of consolidated net sales remained at 98.5%, maintaining its position as the core business. Research and development expenses increased year-on-year due to the continued promotion of technology development for the future.
Key Products
Growth Drivers
- Continued expansion of demand for HBM (High Bandwidth Memory) driven by the spread of generative AI
- Robust demand for GPUs and high-performance memory semiconductors driven by continued large-scale investment in data centers
- Strengthened order-response capability through expanded production capacity for Probe Cards for Memory
- Deep customer relationships with Samsung Electronics and Micron Memory Taiwan (together accounting for 71.3% of net sales)
- New customer acquisition and market expansion through MEMS-type probe cards for non-memory applications
- Growth outlook exceeding the company's forecast of 14% growth in the probe card market in 2026
Risks
- Risk of sales concentration in Samsung Electronics and Micron Memory Taiwan (together accounting for 71.3% of net sales)
- Delayed recovery in demand for probe cards in the NAND flash market
- Prolonged inventory adjustment in the non-memory segment for automotive semiconductors and industrial applications
- Risk of demand fluctuation due to sharp changes in semiconductor market conditions (the company uses a two-quarter-ahead forecast due to the difficulty of predicting full-year performance)
- Impact on the supply chain and customer demand from a resurgence of US-China trade and technology friction or geopolitical risk
- Risk of increased fixed costs and lower utilization rates due to expanded capital investment (net machinery, equipment, and vehicles increased by ¥1,802 million from the end of the previous fiscal year)
Last updated: March 25, 2026

