ENVALITH
ザインエレクトロニクス株式会社 logo

THine Electronics, Inc.

6769Standard MarketElectric Appliances

ザインエレクトロニクス株式会社 logo
THine Electronics, Inc.6769

LSI Business

Fabless mixed-signal LSI development and sales business centered on proprietary analog technology

PeriodCurrentPreviousChange
Sales revenue (Q1 FY2026, ending December 2026)¥360 million¥485 million (Q1 FY2025, ending December 2025)
Operating loss (Q1 FY2026, ending December 2026)-¥400 million-¥168 million (Q1 FY2025, ending December 2025)
EBITDA (Q1 FY2026, ending December 2026)-¥386 million-¥151 million (Q1 FY2025, ending December 2025)
Gross profit (Q1 FY2026, ending December 2026)¥235 million¥349 million (Q1 FY2025, ending December 2025; down 32.7% year on year)
R&D expenses (Q1 FY2026, ending December 2026)¥410 million¥288 million (Q1 FY2025, ending December 2025; up 42.3% year on year)

Business Details

A fabless manufacturer that develops and sells mixed-signal LSIs as ASSPs for industrial equipment, automotive, and consumer equipment applications, based on proprietary analog design and logic design technologies. Manufacturing is outsourced to domestic and overseas foundries. Main products include the High-Speed Video Transmission LSI (V-by-One®HS), LCD Panel Controller Integrated LSI, Power Management LSI, and Image Signal Processing LSI (ISP), among others. Also engages in IP License (Royalty Income). In Q1 of FY2026 (ending December 2026), sales composition was 56% industrial equipment, 25% automotive, and 19% consumer equipment.

Recent Overview

Sales revenue down 25.8% year on year; operating loss expanded significantly due to a surge in R&D expenses

Sales revenue for the LSI Business in Q1 of FY2026 (ending December 2026) was ¥360 million (down 25.8% year on year). Industrial equipment applications (56% of sales) showed signs of a recovery trend for amusement equipment applications, but OA equipment applications remained sluggish, resulting in an overall decline of 34% year on year. Automotive applications (25%) increased 3% year on year, driven by the US market and other regions. Consumer applications (19%) declined 27% year on year. Meanwhile, R&D expenses toward the mid-term management strategy "Innovate100" surged to ¥410 million (up 42.3% year on year), and the operating loss expanded to ¥400 million (from ¥168 million in the prior period). The exhibition of the optical semiconductor solution at OFC2026 attracted significant attention.

Key Products

product
V-by-One®HS High-Speed Video Transmission LSI

Promoting the adoption of the next-generation high-speed interface standard technology "V-by-One®HS plus Standard." Expanding the new product lineup for EV panel applications. Shipments continue to increase for the US market and other regions, with the automotive equipment market up 3% year on year.

product
LCD Panel Controller Integrated LSI

Deployed for industrial equipment and consumer equipment applications. Sales for the consumer equipment market declined sharply, down 27% year on year.

product
Power Management LSI, LED Driver, and Power Module

Development of new power products was carried out during Q1. Deployed for industrial equipment and automotive applications.

product
Image Signal Processing LSI (ISP)

Deployed for industrial equipment and consumer equipment applications. Sales for OA equipment applications were sluggish.

product
Optical Semiconductor Chipset (DSP-less)

Under development as the world's first DSP-less optical semiconductor solution. Exhibited at OFC2026 (Los Angeles, US) in March 2026, gaining interest from numerous companies. Plans to mass-produce PCI Express 6.0-compatible products in 2027 and PCI Express 7.0-compatible products in 2028. Development is being accelerated with support from an NICT grant program.

service
IP License (Royalty Income)

Licenses proprietary technologies such as V-by-One®HS to third parties. Functions as a revenue source alongside LSI sales.

Growth Drivers

  • Progress in the development of optical semiconductor products for AI data centers (the world's first DSP-less technology) and accelerated R&D following selection for an NICT grant, with mass production shipment of PCI Express 6.0/7.0-compatible products planned for 2027 and 2028
  • Increased shipments in the automotive market due to expansion of the new V-by-One®HS product lineup for EV panel applications (steady performance in the US market, up 3% year on year)
  • Increased shipments to the industrial equipment market due to an emerging recovery trend from customer inventory adjustments in the amusement equipment market
  • Progress in the adoption of the next-generation high-speed interface standard technology "V-by-One®HS plus Standard"
  • Development of new markets through the development of new power products and next-generation high-speed wireless communication technology beyond 5G

Risks

  • Risk that the continued sluggishness in OA equipment applications will delay the overall recovery of the industrial equipment market
  • Outlook that profit pressure will continue due to a significant increase in R&D expenses (¥410 million in Q1 alone, up 42.3% year on year)
  • Materializing risk of market contraction as sales to the consumer equipment market declined sharply, down 27% year on year
  • Risk of order declines due to the impact of US tariff concerns on the China market
  • Risk of development delays and mass-production challenges for new optical semiconductor products (PCI Express 6.0/7.0-compatible)

Last updated: March 26, 2026