ISHII HYOKI.CO.,LTD.
6336・Standard Market・Machinery
Business
Ishii Hyoki Co., Ltd. was founded in 1973 and is headquartered in Fukuyama City, Hiroshima Prefecture, listed on the Tokyo Stock Exchange Standard Market. The company has 6 consolidated subsidiaries (including 1 sub-subsidiary) and operates two core business segments: the "Electronic Equipment & Parts Manufacturing Equipment" segment, which handles manufacturing equipment for printed circuit boards and LCDs (polishing machines, plating lines, Inkjet Coaters, etc.), and the "Displays & Electronic Components" segment, which covers membrane switch panels, electronic components mounting, and printing for automotive components. Its main customers include printed circuit board manufacturers, LCD panel manufacturers, machine tool and industrial machinery manufacturers, and automotive-related manufacturers. The company has production bases in China (Shanghai, Suzhou) and the Philippines, and conducts business globally.
Business Model
In the Electronic Equipment & Parts Manufacturing Equipment segment, which accounts for approximately 31% of revenue, the company builds up stock-type revenue through continued sales of Production Consumables in addition to sales of manufacturing equipment for printed circuit boards and liquid crystal displays. In the remaining approximately 69%, the Displays & Electronic Components segment, the company secures stable sales through contract electronic component mounting utilizing its subsidiaries in China and the Philippines, as well as the manufacture and sale of operation panels and printed products. The combination of equipment, consumables, and contract manufacturing forms a structure that diversifies revenue against economic fluctuations.
Company Strengths
The Electronic Equipment & Parts Manufacturing Equipment segment achieved net sales of ¥4,876 million, operating profit of ¥806 million, and an operating margin of 16.5% in FY2026 (ending March 2026). Driven by increased capital expenditure on AI-related package substrates, the segment achieved high growth of 6.5% year-on-year in net sales and 24.6% year-on-year in operating profit.
At Shanghai SunRise Electronics Co., Ltd., orders for electronic components mounting from major customers, including those related to EVs, trended upward, contributing to overall increases in both revenue and profit for the Displays & Electronic Components segment (net sales up 5.2% year-on-year, operating profit up 28.3% year-on-year). Order intake remained strong, up 10.3% year-on-year.
At the end of FY2026 (ending March 2026), the equity ratio stood at 66.9% and interest-bearing debt balance was ¥1,276 million, indicating a high level of financial soundness. The company has secured a liquidity buffer including an unexecuted commitment line balance of ¥1,800 million, while the syndicated loan balance has also been reduced to ¥357 million (term loan).
ENVALITH's Perspective
Performance Trend
Over the past five fiscal years, performance peaked in FY2023 (net sales of ¥18,222 million, operating profit of ¥2,016 million), then declined sharply through FY2025 (net sales of ¥14,821 million, operating profit of ¥907 million), before turning to recovery from FY2026 (net sales of ¥15,651 million, operating profit of ¥1,140 million). For the cumulative first quarter of FY2027 (ending January 2027), net sales were ¥4,049 million (+12.3% year on year) and operating profit was ¥367 million (+98.8% year on year), indicating an accelerating recovery. As an external factor, growing demand for AI-related semiconductors is boosting demand for Printed Circuit Board Manufacturing Equipment, and the full-year forecast (net sales of ¥16,666 million, operating profit of ¥1,155 million) anticipates an increase in both revenue and profit compared with the previous fiscal year. On the other hand, stagnation in the Chinese economy, production adjustments for automotive applications, and sluggish demand for liquid crystal displays continue to act as downward pressures.
Growth Strategy
Diversifying the earnings base by capturing AI- and EV-related demand and expanding coating technology into new markets
Capturing the increase in capital investment for package substrates driven by growing demand for AI-related semiconductors, the company aims to expand sales of related manufacturing equipment, production consumables, and plating equipment for high-functionality materials. In Q1 of FY2027 (ending January 2027), sales in the Printed Circuit Board-related Business increased 43.7% year on year to ¥1,009 million from ¥702 million in the same period of the previous year, indicating that the strategy is progressing well.
The company aims to expand the inkjet coating technology developed for liquid crystal applications horizontally into new markets such as environmental load reduction, thereby developing new revenue sources to complement the structural decline of the liquid crystal-related business. Sales in the liquid crystal-related business in Q1 of FY2027 (ending January 2027) increased to ¥189 million from ¥135 million in the same period of the previous year, but new demand for manufacturing equipment remains limited, and full-scale development of new markets is still at an early stage.
The company aims to develop new customers and secure new mass-production products at Silk & Label Printing (JPN, INC.), and to achieve a recovery in orders for electronic components mounting, including EV-related orders, at Shanghai Sailuoke Electronics Co., Ltd. In Q1 of FY2027 (ending January 2027), Silk & Label Printing (JPN, INC.) recorded an operating loss due to customer production adjustments and rising material prices, while Shanghai Sailuoke's performance remained roughly in line with the same period of the previous year, indicating that improvement remains halfway through.
The annual dividend forecast for FY2027 (ending January 2027) has been raised to ¥36 per share (up 28.6% from ¥28 in the previous fiscal year). This reflects the company's policy of returning profit growth accompanying the business recovery to shareholders, and is positioned as part of efforts to improve capital efficiency aimed at resolving the sub-1x PBR situation.
Last updated: July 17, 2026

