ENVALITH
ローツェ株式会社 logo

RORZE CORPORATION

6323Prime MarketMachinery

ローツェ株式会社 logo
RORZE CORPORATION6323

Semiconductor & FPD Related Equipment Business

Core business developing, manufacturing, and selling dust-free transfer equipment for the semiconductor and FPD industries

PeriodCurrentPreviousChange
Segment sales (1Q FY2027, ending February 2027)¥37,075 million¥32,950 million (1Q FY2026, ending February 2026)
Segment profit (1Q FY2027, ending February 2027)¥10,834 million¥8,786 million (1Q FY2026, ending February 2026)
Segment sales (full year FY2026, ending February 2026)¥127,593 million¥123,442 million (full year FY2025, ending February 2025)
Segment profit (full year FY2026, ending February 2026)¥32,003 million¥32,952 million (full year FY2025, ending February 2025)
Orders received (1Q FY2027, ending February 2027)¥45,788 million¥24,076 million (1Q FY2026, ending February 2026, estimate)
Order backlog (end of 1Q FY2027, ending February 2027)¥67,963 million¥55,336 million (end of FY2026, ending February 2026)
Segment profit margin (1Q FY2027, ending February 2027)29.2%26.7% (1Q FY2026, ending February 2026)

Business Details

Develops, manufactures, and sells clean-room-compatible dust-free transfer equipment (EFEM, Wafer Sorter, N₂ Purge-Compatible Wafer Stocker, etc.), vacuum wafer transfer equipment, analysis equipment, large glass substrate transfer systems, and other products for the semiconductor and FPD industries. Major customers are Applied Materials, Inc. (sales of ¥8,130 million in 1Q FY2027 (ending February 2027), 21.9% of segment sales) and TSMC (¥6,768 million, 18.2%). This core segment accounts for approximately 99% of consolidated net sales. The Vietnamese subsidiary serves as the main plant for semiconductor-related equipment, while the Korean subsidiary handles FPD-related equipment.

Recent Overview

1Q orders received surged 190.2% year on year, and the order backlog reached a record high level

In the first quarter of FY2027 (ending February 2027) (March to May 2026), orders received in the Semiconductor & FPD Related Equipment Business expanded rapidly to ¥45,788 million (up 190.2% year on year). This was driven by semiconductor-related equipment at ¥42,030 million (up 188.4% year on year) and analysis equipment at ¥2,366 million (up 396.3% year on year). The order backlog reached ¥67,963 million (up 127.9% year on year), an increase of ¥22,627 million from the end of FY2026 (ending February 2026). Sales were ¥37,075 million (up 12.5% year on year), and segment profit was ¥10,834 million (up 23.3% year on year). Sales to the major customer Applied Materials increased substantially to ¥8,130 million (21.9% of segment sales), up from ¥5,058 million (15.3%) in the same period of the prior year. Sales to the United States also became the largest by region at ¥11,062 million, up year on year.

Key Products

product
EFEM (Atmospheric Wafer Transfer System)

An atmospheric wafer transfer system used in semiconductor manufacturing processes to remove wafers from FOUPs and transfer them to processing equipment. Constitutes the core product group within semiconductor-related equipment.

product
Wafer Sorter

Equipment that automates the sorting and alignment of wafers in semiconductor manufacturing processes. Included in the semiconductor-related equipment category.

product
N₂ Purge-Compatible Wafer Stocker

Equipment that stores wafers in a nitrogen atmosphere to prevent oxidation and contamination. Addresses quality control needs in advanced semiconductor manufacturing.

product
Fully Automatic Vapor Phase Decomposition (VPD) System (Analysis Equipment)

Orders for analysis equipment in 1Q FY2027 (ending February 2027) expanded rapidly to ¥2,366 million (up 396.3% year on year). The order backlog reached ¥4,672 million (up 134.1% year on year), drawing attention as a growth item.

product
FPD Related Equipment (Large Glass Substrate Transfer System / Glass Cutting Machine)

Sales of FPD-related equipment in 1Q FY2027 (ending February 2027) increased substantially to ¥2,032 million (up 202.9% year on year). However, the order backlog remained at a low level of ¥1,037 million (37.6% of the prior-year level).

Growth Drivers

  • Expansion of capital investment in advanced logic and memory fields for data centers, driven by the spread of generative AI
  • Rapid expansion of sales to Applied Materials (¥8,130 million in 1Q FY2027, ending February 2027, up 60.7% year on year), reflecting increased demand from the United States
  • Surge in orders for analysis equipment (VPD systems, etc.) (orders of ¥2,366 million in 1Q FY2027, ending February 2027, up 396.3% year on year)
  • Continued demand from Taiwanese customers (TSMC, etc.) (sales of ¥6,768 million in 1Q FY2027, ending February 2027)
  • Recovery in sales of FPD-related equipment (sales of ¥2,032 million in 1Q FY2027, ending February 2027, up 202.9% year on year)
  • Enhancement of production capacity through construction of a new plant at the Vietnamese subsidiary (RORZE ROBOTECH CO., LTD.), scheduled to begin operation in spring 2028
  • Expansion of aftermarket revenue through increased sales of parts, repairs, and other items (¥3,913 million in 1Q FY2027, ending February 2027, up 127.9% year on year)

Risks

  • U.S. patent litigation with Kawasaki Heavy Industries, Ltd. (jury verdict of provisional damages of $48 million, currently under appeal); a provision for litigation losses of ¥7,429 million has been recorded under fixed liabilities
  • Risk of impact on sales to China from U.S. semiconductor export control regulations and U.S.-China trade regulations (sales to China of ¥9,234 million in 1Q FY2027, ending February 2027)
  • Profit pressure from goodwill amortization burden (¥810 million in 1Q FY2027, ending February 2027)
  • Uncertainty regarding medium-term sales contribution due to the low order backlog level for FPD-related equipment (¥1,037 million at the end of 1Q FY2027, ending February 2027, 37.6% of the prior-year level)
  • Risk of natural disasters at the Vietnamese subsidiary (there is a history of typhoon damage) and risk of deterioration in the parts procurement environment
  • Risk regarding whether production capacity can keep pace with the rapid expansion of orders received (up 190.2% year on year)

Last updated: May 22, 2026