ENVALITH
伯東株式会社 logo

Hakuto Co.,Ltd.

7433Prime MarketWholesale Trade

伯東株式会社 logo
Hakuto Co.,Ltd.7433

Electronic Components Business

Largest segment of the Hakuto Group. Sells semiconductor devices and electronic components both domestically and internationally.

PeriodCurrentPreviousChange
Net Sales¥140,274 million¥142,961 million
Segment Profit¥3,933 million¥5,239 million
Depreciation and Amortization¥635 million¥622 million

Business Details

The core business of the Hakuto Group, selling semiconductor devices (approximately 80% of segment sales) and general electronic components, among others. In addition to domestic sales, the business operates across Asia, Europe and the Americas through an overseas subsidiary network comprising Hakuto Enterprises Ltd. (Hong Kong), Hakuto Enterprises (Shanghai) Ltd., Hakuto (Thailand) Ltd., Hakuto Singapore Pte. Ltd., Hakuto Taiwan Ltd., Hakuto Trading (Shenzhen) Ltd., Hakuto America Inc., and Hakuto Czech s.r.o. Consolidated subsidiary Moldec Co., Ltd. also handles manufacturing, sales and contract processing of electronic components. The major customer is DENSO Corporation.

Recent Overview

Both net sales and profit declined year on year due to continued weakness in automotive and industrial equipment demand.

In FY2026 (ending March 2026), net sales of the Electronic Components Business were ¥140,274 million (down 1.9% from ¥142,961 million in the prior period), and segment profit was ¥3,933 million (down 24.9% from ¥5,239 million in the prior period). Prolonged inventory adjustments continued for automotive-related applications (amid the EV slowdown) and industrial equipment, compounded by weakness in the Chinese market. Meanwhile, semiconductors for AI-related and data center applications remained solid. From FY2026 (ending March 2026), Rabyte Pte. Ltd. and Rabyte Edge Pvt. Ltd. (each 76% acquired) newly joined as consolidated subsidiaries, strengthening the platform for expansion into India and the ANZ region. Sales to DENSO Corporation, the major customer, changed from ¥21,125 million in the prior period (the specific amount for FY2026 (ending March 2026) was not disclosed).

Key Products

product
Semiconductor Devices

Sells a wide range of semiconductor devices, including those for AI-related applications and data centers, to domestic and overseas customers. Supplies diverse end markets including automotive, industrial equipment, consumer electronics, and telecommunications.

product
General Electronic Components

Sells general electronic components such as connectors and passive components. Consolidated subsidiary Moldec Co., Ltd. handles manufacturing, sales, and contract processing.

Growth Drivers

  • Expansion of semiconductor demand for AI-related and data center applications (increased corporate demand accompanying the shift from generative AI to AI agents)
  • Sales opportunities arising from price increases amid tight memory supply-demand conditions
  • New expansion into India and the ANZ region through the consolidation of Rabyte Pte. Ltd. and Rabyte Edge Pvt. Ltd. as subsidiaries
  • Strengthening of overseas sales leveraging the overseas subsidiary network (Asia, Europe and the Americas, India, etc.)
  • Strengthening of the value chain and transition to a solutions provider through engineer headcount increases and business/capital alliances with external partners
  • Promotion of growth investment under the medium-term management plan "Hakuto 2028"

Risks

  • Sluggish sales due to prolonged inventory adjustments for automotive-related applications (continued EV slowdown) and industrial equipment
  • Risk of loss of business rights due to continued weakness in the Chinese market and accelerating replacement by other manufacturers
  • Foreign exchange fluctuation risk in foreign-currency-denominated export transactions (foreign exchange losses pressuring ordinary income)
  • Risk of fluctuations in semiconductor product transaction prices and supply chain inventory levels
  • Prolonged market bifurcation due to continued weak end demand in fields other than AI-related applications
  • Risk of increased costs associated with the integration and goodwill amortization of newly consolidated subsidiaries (Rabyte Pte. Ltd., Rabyte Edge Pvt. Ltd.)

Last updated: June 23, 2026