Shikino High-Tech CO.,LTD.
6614・Standard Market・Electric Appliances
Electronic Systems Business
A business centered on semiconductor testing equipment and burn-in-related devices, with high dependence on the automotive sector
| Period | Current | Previous | Change |
|---|---|---|---|
| Sales revenue (FY2026, ending March 2026, full year) | ¥3,060 million | ¥3,020 million | ↑ |
| Segment operating income/loss (FY2026, ending March 2026, full year) | -¥182 million | -¥29 million | ↓ |
| Segment assets (end of FY2026, ending March 2026) | ¥2,802 million | ¥2,050 million | ↑ |
| Depreciation expense (FY2026, ending March 2026, full year) | ¥93 million | ¥96 million | ↓ |
| Capital expenditures (FY2026, ending March 2026, full year) | ¥17 million | ¥78 million | ↓ |
Business Details
Develops, manufactures, and sells Burn-in Systems and Burn-in Boards, Dedicated Measuring Instruments, and other products for semiconductor manufacturing plants. Major customers include Sony Semiconductor Solutions, Denso, Renesas Electronics, and other semiconductor manufacturers serving the automotive and industrial sectors. Production takes place at the Uozu Plant and Fukushima Office, with a direct sales system as the basic approach. The business structure is directly susceptible to inventory adjustment phases in automotive semiconductors, and the company is pursuing diversification into non-automotive areas such as custom burn-in systems for AI and data centers.
Recent Overview
Slight revenue increase but operating loss expanded significantly, amid a mix of automotive sluggishness and image sensor growth
In the Electronic Systems Business for FY2026 (ending March 2026), sales revenue was ¥3,060 million (up 1.3% year on year), a slight increase, but the segment operating loss worsened significantly to ¥182 million (compared with a loss of ¥29 million in the prior period). While orders for back-end semiconductor products and automotive dedicated measuring instruments remained sluggish due to continued inventory adjustments in automotive semiconductors, orders for custom burn-in boards for image sensors increased substantially, and development and manufacturing of custom burn-in systems for high-power LSIs was also completed. The Fukushima manufacturing department saw a decline in orders, compounded by the impact of U.S. reciprocal tariffs.
Key Products
Growth Drivers
- Expanded orders for custom burn-in boards for image sensors (achieved a substantial increase in FY2026, ending March 2026)
- Creation of new sales opportunities following completion of development and manufacturing of custom burn-in systems for high-power LSIs
- Expanded orders for custom burn-in systems and boards for AI and data center applications
- Development of new markets as non-automotive measuring instrument development advances to the final phase
- Progress in development for new customers at the Fukushima Office (ongoing despite delays)
Risks
- Continued suppression and freezing of capital expenditure by major customers due to prolonged inventory adjustments in automotive semiconductors
- Rapid progress of burn-in elimination (aimed at reducing test costs) by some customers
- Decline in orders at the Fukushima Office due to the impact of U.S. reciprocal tariffs
- Profit pressure from a sharp rise in material costs for semiconductor reliability testing equipment
- Risk of stagnant order growth due to delays in development for new customers
- Continued weakness in the automotive market (weak automotive market conditions are also expected in FY2027, ending March 2027)
Last updated: June 23, 2026