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テクセンドフォトマスク株式会社 logo

Tekscend Photomask Corp.

429APrime MarketOther Products

テクセンドフォトマスク株式会社 logo
Tekscend Photomask Corp.429A

Photomask-related Business (Tekscend Photomask Corp., single segment)

A global leading company holding a 37.8% share of the worldwide merchant photomask market

PeriodCurrentPreviousChange
Revenue (FY2026, ending March 2026, full year)¥129,576 million¥117,974 million
Operating profit (FY2026, ending March 2026, full year)¥27,530 million¥28,199 million
Operating margin (FY2026, ending March 2026, full year)21.2%23.9%
Profit before tax (FY2026, ending March 2026, full year)¥33,432 million¥30,771 million
Profit attributable to owners of the parent (FY2026, ending March 2026, full year)¥24,947 million¥9,945 million
Depreciation and amortization (FY2026, ending March 2026, full year)¥18,486 million¥15,240 million
Cash flow from operating activities (FY2026, ending March 2026, full year)¥36,061 million¥26,227 million
Capital expenditures on property, plant and equipment (FY2026, ending March 2026, full year)¥33,207 million¥30,691 million
Total assets (as of March 31, 2026)¥230,725 million¥167,752 million
Ratio of equity attributable to owners of the parent (as of March 31, 2026)75.6%69.4%
Basic earnings per share (FY2026, ending March 2026, full year)¥261.12¥104.16
Annual dividend per share (FY2026, ending March 2026)¥56.00 (payout ratio 21.4%)¥0.00

Business Details

A merchant photomask vendor specializing exclusively in the manufacture and sale of semiconductor photomasks. Leveraging a global production network spanning 8 sites worldwide (5 in Asia, 1 in the U.S., 2 in Europe), the company supplies a broad range of photomasks—from leading-edge products including EUV masks to legacy products—entirely on a made-to-order basis to semiconductor manufacturers such as foundries, IDMs, and design houses, as well as research institutions. In 2024, the company held the top share of the merchant semiconductor photomask market at 37.8% (Source: SEMI "2024 PHOTOMASK CHARACTERIZATION STUDY"). In FY2026 (ending March 2026), the company achieved revenue of ¥129,576 million (up 9.8% year on year), but operating profit declined to ¥27,530 million (down 2.4% year on year) due to increased material costs and depreciation expenses as well as one-time costs associated with the listing.

Recent Overview

Revenue rose 9.8% year on year to ¥129,576 million, while operating profit declined slightly due to one-time costs associated with the listing, among other factors

In FY2026 (ending March 2026), the photomask market performed solidly across all nodes, from leading-edge to mature, against the backdrop of expanding semiconductor demand for generative AI and data centers, resulting in revenue of ¥129,576 million (up 9.8% year on year). On the other hand, operating profit declined to ¥27,530 million (down 2.4% year on year) and the operating margin fell to 21.2% (from 23.9% in the prior year) due to increased material costs and depreciation expenses (depreciation of ¥18,486 million, up ¥3,246 million year on year) as well as increased one-time costs associated with the listing. Profit before tax rose to ¥33,432 million (up 8.6% year on year), supported by an increase in financial income (¥7,151 million). Income tax expense decreased sharply from ¥20,825 million in the prior year to ¥8,484 million, resulting in a substantial increase in profit attributable to owners of the parent to ¥24,947 million (up 150.9% year on year). Cash flow from financing activities turned positive due to proceeds from the issuance of new shares associated with the new listing (proceeds of ¥19,992 million), and the fiscal year-end cash balance expanded to ¥51,552 million (up ¥23,837 million year on year). For FY2027 (ending March 2027), the company forecasts revenue of ¥140,100 million (up 8.1% year on year) and operating profit of ¥29,800 million (up 8.2% year on year). The company is advancing growth investments including the start-up of a new plant in Singapore, the introduction of new lines in the U.S. and South Korea, and preparations for mass production of EUV lines in Japan.

Key Products

product
EUV Photomask

A high-precision photomask for extreme ultraviolet (EUV) exposure equipment. Demand is expanding in line with progress in semiconductor miniaturization and higher integration, and it represents a core product in the group's advanced fine-processing technology. The company is advancing efforts to support mass production of EUV lines in Japan.

product
Binary Mask (OMOG)

A photomask composed of a binary pattern that transmits and blocks light. Its OMOG (Opaque MoSi on Glass) structure supports ArF excimer laser exposure. It maintains stable demand across a wide range of applications, centered primarily on mature processes.

product
Phase Shift Mask (PSM)

A photomask that utilizes the phase difference of light to improve pattern resolution and contrast. Used for leading-edge logic and memory nodes, it is a high-value-added product that enables highly precise fine pattern formation.

product
Nanoimprint Mold

A mold used in nanoimprint lithography (NIL). It is part of the product lineup positioned to address next-generation semiconductor manufacturing processes.

product
Silicon Stencil Mask

A mask with a stencil structure formed with patterns directly on a silicon substrate. It is a highly specialized product offered for specialized processes such as ion implantation and electron beam lithography.

Growth Drivers

  • Continued expansion of demand for AI- and cloud-related semiconductors driving increased demand for leading-edge photomasks
  • Expanding demand for EUV masks accompanying the accelerating mass-production adoption of EUV lithography (advancing efforts to support mass production of EUV lines in Japan)
  • Capturing merchant photomask demand driven by foundries' expanding adoption of leading-edge nodes and shortages of internal resources
  • Trend among memory manufacturers toward outsourcing photomasks for leading-edge memory amid expanding AI-related demand
  • Accelerating investment in new plant and line construction across regions amid economic security concerns and reshoring of semiconductor supply chains
  • Expansion of production capacity from 2027 onward through the start-up of the new Singapore plant and introduction of new lines in the U.S. and South Korea
  • Steady underlying demand for core photomask products driven by volume growth in legacy-node semiconductors for IoT and automotive applications
  • Capacity optimization through a global production network of 8 sites worldwide and a virtual "single factory" operating model

Risks

  • Downward pressure on operating margin from increased depreciation expenses associated with upfront investment (capital expenditures and EUV-related R&D) (depreciation of ¥18,486 million in FY2026, ending March 2026, trending upward year on year)
  • Rise of local competitors in the Chinese market and intensifying competition to capture demand
  • Geopolitical risk and supply chain disruption stemming from U.S.-China decoupling and tightening export controls
  • Risk of rising energy costs and supply chain disruption due to escalating tensions in the Middle East
  • Disparities in demand across semiconductor products and applications (strong demand related to AI, while smartphones, automotive, and other segments show sluggish recovery)
  • Growing difficulty in maintaining cost competitiveness due to progressing end-of-life (EOL) status of legacy manufacturing equipment
  • Foreign exchange risk (impact of translation differences related to overseas operating entities arising from the global multi-site expansion; a positive impact of ¥13,552 million in FY2026, ending March 2026)
  • Uncertainty regarding changes in the cost structure and recovery of profit margins after the disappearance of one-time costs following the listing

Last updated: June 24, 2026