RS Technologies Co., Ltd.
3445・Prime Market・Metal Products
Wafer Reclaim Business
RS Technologies' core business. Engages in silicon wafer reclaim processing, processing, and sales for semiconductor manufacturers in Japan and overseas.
| Period | Current | Previous | Change |
|---|---|---|---|
| External customer sales (quarterly) | ¥7,038 million (Q1 FY2026, ending March 2026) | ¥6,612 million (Q1 FY2025, ending March 2025) | ↑ |
| Segment operating profit (quarterly) | ¥2,710 million (Q1 FY2026, ending March 2026) | ¥2,378 million (Q1 FY2025, ending March 2025) | ↑ |
| External customer sales (full year, prior year actual) | ¥27,528 million (full year FY2025, ended March 2025) | — | — |
| Segment operating profit (full year, prior year actual) | ¥10,167 million (full year FY2025, ended March 2025) | — | — |
| Processing revenue from customer-provided materials (quarterly) | ¥4,752 million (Q1 FY2026, ending March 2026) | ¥4,213 million (Q1 FY2025, ending March 2025) | ↑ |
| Sales of goods revenue (quarterly) | ¥2,285 million (Q1 FY2026, ending March 2026) | ¥2,398 million (Q1 FY2025, ending March 2025) | ↓ |
Business Details
A business that receives used monitor wafers from the semiconductor manufacturing process and reclaims them to near-new quality through processes such as stripping/etching, polishing, cleaning, and inspection. Operated across three sites in Japan (Sannohe Plant), Taiwan (Tainan Plant), and China, serving global semiconductor manufacturing companies including major foundries such as TSMC. A single wafer can be reclaimed 10 to 20 times, making this a high-value-added service that contributes to customer cost reduction. Also includes the Silicon Wafer Sales Business and the Oxide Film Deposition Processing Service Business.
Recent Overview
In Q1 FY2026 (ending March 2026), both sales and profit increased year on year, showing strong performance.
In the first quarter of FY2026 (ending March 2026), the Wafer Reclaim Business segment's external customer sales were ¥7,038 million (up 6.4% year on year), and segment profit was ¥2,710 million (up 14.0% year on year). Processing of customer-provided materials (reclaim processing service) increased 12.8% year on year to ¥4,752 million, driving revenue growth. Sales of goods decreased 4.7% year on year to ¥2,285 million. Intersegment sales (transfers) were zero, with all sales attributable to external customers.
Key Products
Growth Drivers
- Increasing demand for monitor wafer reclaiming driven by the expansion of demand for high-performance semiconductors amid the spread of generative AI
- Expansion of production capacity and market share through capacity-expansion capital investment at the Sannohe Plant (Japan) and Tainan Plant (Taiwan)
- Deepening business relationships with major foundries such as TSMC
- Enhanced value-added offerings through advancement of reclaim technology for high-end 12-inch (300mm) wafers
- Capturing global customer demand through the three-site structure in Japan, Taiwan, and China
Risks
- Fluctuations in semiconductor market demand (risk of reduced reclaim demand during economic downturns or capital expenditure restraint)
- Increased costs to meet demands for more advanced reclaim technology as semiconductor miniaturization progresses
- Growing uncertainty in the trade and investment environment due to U.S. additional tariffs and other protectionist policies
- Risk of revenue concentration among major customers (such as TSMC)
- Downward pressure on profit margins from rising depreciation expenses associated with increased capital investment
Last updated: March 26, 2026