ENVALITH
日本電子材料株式会社 logo

JAPAN ELECTRONIC MATERIALS CORPORATION

6855Standard MarketElectric Appliances

日本電子材料株式会社 logo
JAPAN ELECTRONIC MATERIALS CORPORATION6855

Semiconductor Inspection Components Business

The company's core business, centered on probe cards, accounting for over 99% of sales.

PeriodCurrentPreviousChange
Segment Sales¥29,142 million¥23,603 million
Segment Profit¥9,139 million¥6,033 million
Segment Profit Margin31.4%25.6%
Depreciation and Amortization¥1,259 million¥1,132 million
YoY Sales Growth Rate+23.5%
YoY Segment Profit Growth Rate+51.5%

Business Details

This business develops, manufactures, and sells probe cards used for electrical characteristic testing of semiconductor wafers. It operates three product lines: cantilever-type (C-type), vertical-type (V-type), and MEMS-technology-based M-type. In addition to domestic plants (Head Office, Sanda, Kumamoto), the company sells globally through overseas subsidiaries in the US, Hong Kong, Taiwan, Europe, China, Thailand, and Shenzhen. By capturing demand for advanced semiconductors, centered on probe cards for memory applications, the segment achieved its highest-ever sales and profit since the company's founding in FY2026 (ending March 2026).

Recent Overview

Accelerated sales expansion of memory probe cards drove record sales and profit since the company's founding.

In FY2026 (ending March 2026), demand for advanced memory probe cards, including those for HBM and image processing semiconductors for generative AI, continued to expand, resulting in segment sales of ¥29,142 million (up 23.5% year on year) and segment profit of ¥9,139 million (up 51.5% year on year), both renewing record highs since the company's founding. The full-scale operation of the Kumamoto No. 4 Plant and continued capital investment in existing plants contributed to improved production capacity. Meanwhile, demand for non-memory probe cards remained soft. To strengthen future production capacity, the company resolved in February 2026 to construct a new plant in Amagasaki City, Hyogo Prefecture (scheduled for completion in August 2028).

Key Products

product
M-type Probe Card (MC Series / ML Series / MT Series)

The company's most advanced product lineup, utilizing MEMS (Micro Electro Mechanical Systems) technology. It supports testing of advanced memory such as HBM and image processing semiconductors for generative AI, and was the mainstay product driving sales growth in the current period. The company aims to further strengthen its production capacity through the construction of a new plant in Amagasaki City, Hyogo Prefecture (scheduled for completion in August 2028).

product
V-type Probe Card (VT Series / VS Series / VE Series)

Advanced probe cards consisting of three series: vertical contact type (VT), vertical spring contact type (VS), and combined vertical plus cantilever type (VE). These support a wide range of semiconductor testing applications including non-memory uses, although demand for non-memory applications was soft in the current period.

product
C-type Probe Card (CE Series)

The company's basic product line, adopting a cantilever structure. Widely used for electrical characteristic testing of general-purpose semiconductors. It forms a product lineup that addresses diverse customer needs in combination with M-type and V-type products.

Growth Drivers

  • Continued robust expansion in demand for advanced semiconductors such as image processing semiconductors for generative AI and HBM (High Bandwidth Memory)
  • Progress in expanding sales of high-value-added memory probe cards for domestic and Asian markets
  • Increased production capacity and higher domestic plant utilization rates through full-scale operation of the Kumamoto No. 4 Plant and continued capital investment in existing plants
  • Strengthening of M-type probe card production capacity through construction of a new plant in Amagasaki City, Hyogo Prefecture (scheduled for completion in August 2028)
  • Medium- to long-term demand expansion driven by moves to build new plants to strengthen and secure semiconductor manufacturing infrastructure for data centers
  • Strengthening product competitiveness through continued development of probe cards for next-generation semiconductors

Risks

  • Risk of delayed demand recovery for non-memory probe cards (for automotive, industrial equipment, etc.)
  • Risk of increased costs associated with construction of the new plant (Amagasaki City, scheduled for completion in August 2028) and advance investment in existing plants
  • Risk of sales concentration in major customers (approximately 30% of sales from two Micron-related companies)
  • Fluctuations in semiconductor market demand (uncertainty over recovery of markets other than generative AI applications)
  • Impact on the entire supply chain from developments in US trade policy and heightened geopolitical risk
  • Impact on earnings from foreign exchange rate instability
  • Concerns over a global economic slowdown due to escalating tensions in the Middle East

Last updated: June 24, 2026