Takatori Corporation
6338・Standard Market・Machinery
Electronic Equipment Business
Takatori's core segment. Manufactures and sells semiconductor, new materials, and display manufacturing equipment.
| Period | Current | Previous | Change |
|---|---|---|---|
| Net sales (H1 FY2026, ending March 2026) | ¥2,477 million | ¥3,650 million (H1 FY2025, ending March 2025) | ↓ |
| Segment profit/loss (H1 FY2026, ending March 2026) | -¥34 million (loss) | ¥555 million (profit) (H1 FY2025, ending March 2025) | ↓ |
| Net sales (full year FY2025, ended March 2025) | ¥6,930 million | - | — |
| Orders received (H1 FY2026, ending March 2026) | ¥2,390 million | ¥3,526 million (H1 FY2025, ending March 2025) | ↓ |
| Order backlog (as of March 31, 2026) | ¥3,403 million | ¥3,490 million (as of September 30, 2025) | ↓ |
| Share of consolidated net sales (H1 FY2026, ending March 2026) | 90.6% | 95.4% (H1 FY2025, ending March 2025) | ↓ |
Business Details
Centered on three product groups—Semiconductor Manufacturing Equipment, New Materials Processing Equipment (SiC wafer cutting equipment, etc.), and Display Manufacturing Equipment—this segment supplies manufacturing equipment to electronic component and device manufacturers both in Japan and overseas. It is the core segment, accounting for approximately 90% of consolidated net sales. The overseas sales ratio is high, with Asia as the main export destination. In the first half of FY2026 (ending March 2026), net sales were ¥2,477 million, down 32.1% year on year, and the segment posted a segment loss of ¥34 million.
Recent Overview
In H1 FY2026 (ending March 2026), net sales were ¥2,477 million and segment loss was ¥34 million, a significant deterioration.
In the first half of FY2026 (ending March 2026) (October 2025 to March 2026), the Electronic Equipment Business recorded net sales of ¥2,477 million (down 32.1% year on year) and a segment loss of ¥34 million (versus a segment profit of ¥555 million in the same period of the prior year). Semiconductor Manufacturing Equipment, New Materials Processing Equipment, and Display Manufacturing Equipment all saw sluggish performance as orders for some equipment fell short of plan. The main causes were the continued cautious stance on capital investment in the SiC industry and slowing growth in the EV market. The order backlog stood at ¥3,403 million, only slightly down from the end of the previous period, indicating a limited buildup for the second half.
Key Products
Growth Drivers
- Expanding demand for high-performance semiconductor manufacturing equipment related to data centers and generative AI
- Market recovery following the resolution of SiC wafer inventory buildup, and equipment demand accompanying the establishment of 8-inch SiC mass production capabilities
- Growth in demand for display manufacturing equipment against the backdrop of an expanding OLED panel market
- Increased sales to overseas users (power semiconductors and analog semiconductors)
- New product development and horizontal expansion leveraging eight core technologies (bonding, vacuum, transport, cutting, control, polishing, measurement, and separation)
- Expansion into new applications such as related equipment for the battery field
Risks
- Prolonged slump in orders for SiC equipment for power semiconductors due to sluggish growth in EV market demand
- Buildup of market inventory and price declines due to overproduction by Chinese SiC wafer manufacturers
- Suppression of capital investment and weakening demand caused by US tariff policy
- Risk of customer concentration (TOYO ADTEC PTE. LTD. accounts for 15.6% of net sales)
- Shrinking demand for display equipment from Japanese, Korean, and Taiwanese manufacturers due to expanding market share of Chinese panel manufacturers
- Delay in full-scale capital investment in new materials fields including GaN
Last updated: December 18, 2025