TOWA CORPORATION
6315・Prime Market・Machinery
Semiconductor Manufacturing Equipment Business
TOWA's core segment. Supplies semiconductor manufacturing equipment and precision molds globally.
| Period | Current | Previous | Change |
|---|---|---|---|
| Net sales | ¥49,871 million | ¥48,959 million | ↑ |
| Operating profit | ¥6,518 million | ¥8,353 million | ↓ |
| Segment assets | ¥100,719 million | ¥78,312 million | ↑ |
| Depreciation and amortization | ¥2,861 million | ¥2,442 million | ↑ |
| Increase in property, plant and equipment and intangible assets | ¥3,975 million | ¥5,098 million | ↓ |
| Unamortized goodwill balance | ¥264 million | ¥379 million | ↓ |
Business Details
Develops manufacturing, sales, and after-sales service of precision molds for semiconductor manufacturing, molding equipment, singulation equipment, and related products. The Company and its consolidated subsidiaries operate this business as an integrated unit. With a global customer base centered on China and Southeast Asia, the segment's core offering is equipment supporting the manufacturing processes of memory semiconductors for AI and data centers. This core business accounts for approximately 91.7% of consolidated net sales.
Recent Overview
Net sales reached a record high, but operating profit fell 22.0% year on year due to product mix deterioration and initial-unit costs.
In FY2026 (ending March 2026), net sales in the Semiconductor Manufacturing Equipment Business reached a record high of ¥49,871 million (up 1.9% year on year). Sales to Taiwan and China, as well as sales of singulation equipment, grew on the back of increased investment in general-purpose memory. On the other hand, operating profit was limited to ¥6,518 million (down 22.0% year on year). The main causes were a deterioration in product mix for transfer equipment (a decline in the proportion of high-margin products) and temporary additional costs associated with the initial delivery of compression equipment. While the start of the fiscal year was sluggish due to the impact of U.S. tariff policy, demand recovered from the second half onward, driven mainly by a recovery in general-purpose memory investment for server applications.
Key Products
Growth Drivers
- Continued capital investment in high-performance memory (HBM and general-purpose DRAM) for data centers, driven by the spread of generative AI and physical AI
- Ongoing memory investment for the time being aimed at resolving the tight supply-demand balance for general-purpose memory (supply shortage expected to persist)
- Increase in the proportion of compression equipment sales and improved profitability as mass production of next-generation AI-related logic semiconductors using PLP (Panel Level Package) progresses
- Expansion of singulation equipment sales for memory applications
- Recovery in profit margins through improved product mix once initial-unit costs for compression equipment are absorbed
- Continued investment in China's semiconductor domestic production push and geopolitical risk mitigation in Southeast Asia
- Expanding demand for TSS (after-sales service) and precision molds as customer utilization rates improve
Risks
- Risk of customers postponing or reviewing investment due to U.S. tariff policy
- Risk of profit margin deterioration due to fluctuations in product mix (decline in the proportion of high-margin products)
- Risk of continued upfront cost burden related to compression equipment and initial-unit projects
- Impact on molding equipment sales from prolonged weakness in demand for automotive and industrial semiconductors
- Slowdown in the Chinese economy and expanding geopolitical risk (sales to China account for approximately 40.9% of the total)
- Timing gaps in revenue recognition due to delays in mass-production investment and an increased proportion of orders for products with long lead times, such as evaluation equipment
- Profit pressure from increased development expenses included in cost of sales
Last updated: June 19, 2026